Custom, cloud-optimized data infrastructure ASIC designs incorporating cutting-edge IP, multi-chip packaging and the industry's most advanced process technologies.
With decades of experience, advanced technologies and flexible business models, Marvell optimizes custom ASIC designs for the unique demands of each AI, cloud data center and OEM customer. Our differentiated approach leverages a portfolio of world-class 5nm and 3nm data infrastructure intellectual property (IP) that includes industry-leading 112G XSR SerDes (serializer/de-serializer), Long Reach SerDes, PCIe Gen 6 / CXL 3.0 SerDes, a 240 Tbps parallel die-to-die interconnect, the latest Arm SoC processor subsystems and low cost/complexity packaging.
定制 ASIC
Marvell 的定制化 ASIC 方案专注于满足对复杂、高速、高性能硅的需求，助力下一代 5G 运营商、云数据中心、企业和自动化领域的相应发展。 Our broad and growing portfolio of IP at advanced process nodes, now including 3nm, spanning compute, embedded memories, high-speed SerDes, networking, security and storage, accelerates time to market and is optimized for performance, power and area, enabling optimal returns on investments.
过去 25 年间，Marvell 的全球定制化 ASIC 解决方案团队已交付超过 2000 个定制化 ASIC，并致力于继续打造下一代 ASIC 解决方案的关键技术和 IP。
- Supports leading-edge silicon processes at 14nm, 7nm, 5nm, and now TSMC’s most advanced node, 3nm
- 周全的低功耗设计和测试方法学
- 优化的高密度嵌入式内存
- 为芯片组解决方案提供低功耗、灵活和互通的芯片间接口
- 高速、多方案、混合信号 SERDES IP，速率范围从 1Gbps 到 112Gbps 以上，支持长短距离，广泛应用于以太网、PCIe、SAS、SATA 和众多新兴协议和接口标准
- 行业排名靠前的 Arm 系统级芯片 (SoC) 处理器子系统
3NM ASIC
Industry-leading product portfolio delivering best-in-class power and performance for multi-chip solutions targeting 5G carrier, cloud data center, enterprise networking and automotive applications.
5NM ASIC
Broad standards-based IP portfolio and advanced packaging solutions for multi-chip solutions targeting 5G carrier, cloud data center, enterprise networking and automotive applications.
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